Exclusive Interview with Guanghua Technology: Technology Leadership and Achieving Core Breakthroughs in High-End Electronic Chemicals

Core Guide

On the morning of March 24, the highly anticipated 2026 CPCA Show grandly kicked off at the National Exhibition and Convention Center (Shanghai). As an important player in the PCB field, GHTECH Guanghua Technology, in collaboration with its subsidiary TONESET Dongshuo Technology, showcased under the theme “Technology Leads・Achieving Core Breakthroughs in High-End Electronic Chemicals,” fully demonstrating the company’s achievements and future plans in the field of high-end wet electronic chemicals. At the exhibition, Guanghua Technology was interviewed by PCB Information Network, detailing the highlights of the exhibition, core technologies, and sharing the industrial value behind the technological breakthroughs. Below is the full text.

From Domestic Substitution to Technological Ecosystem: A Journey of “Core Breakthroughs”

Walking into Guanghua Technology’s booth, the striking theme “Technology Leads·Achieving Core Breakthroughs in High-End Electronic Chemicals” attracted the attention of many industry professionals. When asked about the deeper meaning of this theme, a relevant person in charge at Guanghua Technology stated that this is not just a theme, but marks the elevation of the company’s strategy, representing the company’s commitment to not only promote the domestic substitution of products but also to achieve fundamental breakthroughs in core technologies for high-end electronic chemical wet processes. Guanghua Technology is not just providing products but aims to build an independent, controllable, and collaboratively evolving industrial technology ecosystem as a long-term goal.

This vision is fully reflected in the comprehensive range of solutions showcased by Guanghua Technology and its subsidiary Dongshuo Technology. From PCBs to IC substrates, and advanced packaging interconnection technologies, Guanghua Technology provides a series of high-end wet electronic chemical solutions.

In the PCB field, Guanghua Technology focuses on high-reliability key processes. The Uni-DPP integrated level copper features low coating stress, high reliability, stable plating solution, and long lifespan; low pinhole filling is applied in PTH direct filling processes, effectively addressing the risk of PCB appearance defects; oxygen pulse through-hole plating can replace the copper ball pulse system with a new generation process, significantly reducing drag tank time and resolving etching issues caused by uneven surface copper; high-depth plating through-hole plating not only has strong depth capability but also high reliability, helping to reduce costs and increase efficiency; high-frequency, high-speed bonding agent plating has low roughness, high reliability, and low signal loss, directly addressing the pain points of PCB manufacturing.

In the substrate field, Guanghua Technology’s chemical copper deposition solution achieves a balance between high plating speed and low coating stress, with good copper deposition stability; hole filling plating ensures uniform, fine, and dense coatings with high roundness and reliability; while nickel-palladium gold ensures uniformity of palladium and gold coatings while extending the life of the plating solution, providing important support for high-reliability manufacturing of substrates.

In the semiconductor field, Guanghua Technology’s cyanide-free gold plating solution for wafers is stable, compatible with photoresists, and has no environmental pressure; RDL and copper pillar plating have high current densities, good co-planarity of copper pillars, and excellent roundness; tin-silver plating has stable and controllable silver content, effectively inhibiting tin whisker growth, ensuring high reliability.

In terms of metal compounds, electronic-grade copper oxide features high purity, low impurities, and rapid dissolution, significantly enhancing production efficiency while ensuring the stability of high-end copper plating systems, becoming an important support for front-end material quality.

Addressing Pain Points: Empowering High-End Manufacturing Through Technological Innovation

Among the many highlights of the exhibition, Guanghua Technology’s high AR deep blind hole filling plating solution became the focus. Currently, as PCBs and IC substrates evolve towards higher density and smaller sizes, the electroplating filling of deep blind holes has become a key bottleneck affecting yield and reliability.

To address this industry pain point, Guanghua Technology’s high AR deep blind hole filling plating solution delivered impressive results. It was reported that traditional DC plating often encounters “thicker mouths and thinner bottoms” dog bone effects when dealing with deep blind holes, even resulting in issues such as no copper at the bottom of holes and voids, leading to low filling rates and high crack rates after thermal cycling. In contrast, Guanghua Technology’s solution achieves upward super filling, raising the filling rate to over 98% and controlling the void rate to below 0.3%, significantly improving hole filling quality and product reliability.

More critically, this technological upgrade directly translates into performance advantages. Compared to traditional processes that easily lead to signal reflection, impedance fluctuations, and high resistance issues, this solution achieves full copper filling, reducing resistance to below 5mΩ, providing solid assurance for the complete transmission of high-speed and high-frequency signals above 10Gbps.

Embracing the AI Era: Building “Molecular-Level” Reliable Connections for Ultra-High-Speed Interconnection

With the explosive growth in AI computing power demand, the performance of PCB materials faces unprecedented challenges for high-speed and high-frequency signal transmission. In response to this trend, Guanghua Technology presented a technical report titled “Development Technology and Research of Copper Surface Bonding Agents for 224/448 Gbps Scenarios” during the exhibition, highlighting the remarkable technological breakthroughs behind it.

It was introduced that Guanghua Technology’s high-frequency and high-speed bonding agent products utilize refined surface treatment techniques such as “micro-roughening” and “polishing” to reduce the copper surface roughness to an extremely low level, minimizing signal scattering and insertion loss caused by surface irregularities. However, a smooth surface also means the failure of traditional physical anchoring forces. Therefore, Guanghua Technology employs a synergistic design of surface engineering and molecular engineering, modifying the copper surface through surface engineering to create a highly active reaction platform; then using molecular engineering to design efficient “molecular bridges” that establish stable chemical bonding between the copper surface and the resin. This molecular-level bonding ensures that the plating maintains excellent adhesion even on extremely smooth interfaces, preventing delamination.

Guanghua Technology’s product solution is compatible with high-speed substrates ranging from conventional FR-4 to M2~M9 and above, covering transmission needs from 56Gbps to 224Gbps and even 448Gbps. It ensures extremely low signal loss and high fidelity at ultra-high rates for AI servers, while also ensuring reliability under long-term high-load operation, providing critical material technology support for the continuous upgrade of AI computing power.

Deepening Advanced Packaging: From Validation to Mass Production, Entering a New Phase

In the cutting-edge field of semiconductor advanced packaging, Guanghua Technology also demonstrated its technical strength and market progress, with showcased solutions such as cyanide-free gold plating, RDL, and copper pillar plating being important links in advanced packaging interconnection technologies.

When asked about the verification and mass production progress of these solutions with domestic customers, Guanghua Technology provided an encouraging response: “Our products have already been mass-produced and shipped, with multiple customers continuously using and recognizing them.” This statement confirms the maturity and reliability of its technical solutions.

Conclusion

From PCBs to IC substrates, and to semiconductor advanced packaging, Guanghua Technology is firmly advancing along the path of “Technology Leads·Achieving Core Breakthroughs in High-End Electronic Chemicals.” By continuously tackling core technological challenges in wet processes and proactively responding to the high-speed interconnection demands of the AI era, Guanghua Technology not only provides high-performance products for the industry but also plays an increasingly important role in helping to build an independent and controllable industrial technology ecosystem. In the future, we look forward to Guanghua Technology bringing more innovative achievements, injecting stronger momentum into the upgrading and development of the electronic information industry.

News Source | PCB Information Network

Reviewed by | Mai S.X.