SEMICON China 2026: Gaocao Co. showcases core capabilities in 12-inch large silicon wafer slicing and back grinding

(Source: Gaocai Co., Ltd.)

2026 SEMICON China

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On March 25, the annual global semiconductor industry event—SEMICON China 2026—grandly opened at the Shanghai New International Expo Center. Gaocai’s wholly-owned subsidiary, Gaocai Shenchuang, showcased its integrated solutions for slicing, beveling, and thinning 12-inch semiconductor wafers at booth 1619 in Hall N1.

SEMICON China brings together top technologies and resources from both upstream and downstream of the industry chain, serving as an important window for companies to showcase their strength, connect for cooperation, and gain insights into trends. Gaocai Shenchuang continues to iterate its semiconductor technology layout, from third-generation semiconductor materials to integrated solutions for “cutting, beveling, and grinding” of 12-inch silicon wafers, continuously expanding technological boundaries and solidifying the competitiveness of domestic equipment through technological innovation and mass production capabilities. At the exhibition, the company team provided professional and enthusiastic service, engaging in in-depth discussions and exploring technical directions with domestic and international clients.

Focusing on the pain points of the 12-inch semiconductor large wafer processing, Gaocai Shenchuang centers its exhibition on “large size, high precision, integration, and mass production level,” systematically showcasing technological breakthroughs and solution integration capabilities in the three core processes of slicing, beveling, and thinning. From high-speed, high-quality slicing to efficient beveling, and thinning that matches international standards in TTV, it covers the entire process from “raw” to “premium” large silicon wafers, attracting professional audiences, industry clients, and technical peers to stop and observe, engaging in in-depth exchanges with the on-site technical team.

In the slicing process, Gaocai Shenchuang relies on its self-developed 12-inch semiconductor diamond wire slicing machine and specialized diamond wire, achieving high-speed and high-quality slicing processing of large silicon wafers compared to traditional slurry cutting. The equipment has a wider process window; equipped with optimized intelligent tension control and high-speed stability technology, along with upgraded control programs, it effectively reduces silicon material loss and improves yield rate while component optimization further enhances equipment reliability, laying a solid foundation for the first step of large wafer mass production.

In the beveling process, the self-developed high-precision fully automatic beveling machine enhances capacity efficiency through algorithm optimization. Working in synergy with customized beveling grinding wheels, it precisely controls edge profiles and dimensional accuracy, maintaining good shape retention and long service life, with processed surfaces free from chipping and defects, solving industry issues such as edge stress concentration and fragility of large wafers, significantly improving the reliability of subsequent processes.

In the thinning process, fully automatic thinning equipment achieves efficient ultra-precision thinning of large silicon wafers, with dual-station independent grinding and intelligent online detection, balancing processing efficiency with ultra-thin thickness control, meeting the stringent requirements of advanced processes for ultra-thin wafers.

From single equipment to complete line solutions, from process research and development to mass production verification, Gaocai Shenchuang forms an integrated capability for slicing, beveling, and grinding of 12-inch large silicon wafers through “equipment, tools, and process” collaborative research and development and technology closed-loop.

On-site technical engineers explained to the visiting guests: “This solution can reduce cross-equipment debugging costs, enhance overall processing efficiency and quality consistency, providing semiconductor wafer factories with a ‘one-stop’ precision processing solution, helping domestic large silicon wafer manufacturing reduce costs and increase efficiency, with independent control.”

Gaocai Shenchuang insists on “technology leading technological innovation, becoming a leader in comprehensive solutions in the field of semiconductor material processing,” with more advanced technology, more reliable products, and higher quality services, aiding the high-quality development of China’s semiconductor industry.

The exhibition is still in full swing (March 25-27),

Hall N1, booth 1619, Shanghai New International Expo Center,

Gaocai Shenchuang sincerely invites colleagues from all sectors to visit and discuss the future of chips!

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