Zhongwei Company: Launches six new semiconductor equipment products

On September 4th, Jin10 reported that Zhongwei Company announced the launch of six new semiconductor equipment products, including two etching devices and four thin film deposition devices. In terms of etching devices, the new generation of ultra-high aspect ratio plasma etching equipment PrimoUD-RIE and the 12-inch ICP single-chamber etching device PrimoMenova, which focuses on metal etching, aim to meet customer demands in the areas of ultra-high aspect ratio etching and metal etching. For thin film deposition devices, there are three atomic layer deposition products and one epitaxy product, such as the PreformaUniflash metal gate series and the PRIMIOEpita RP dual-chamber reduced pressure epitaxy equipment. These new products are expected to have a positive impact on the company's future expansion in the semiconductor equipment market and growth in performance. The new products are still in the early stage of market introduction, with risks related to market promotion and customer validation, which may bring uncertainty to the company's revenue and profitability.